Igumbi lokuhlola ukuguga elisheshayo le-LT-HAST-250 HAST

Incazelo emfushane:

Igumbi le-HAST (Highly Accelerated Stress Test) lisebenzisa indawo engagcwele umusi enomfutho ophezulu ukuze lenze ukuhlolwa kokuguga okusheshayo kanye nokungabi khona kwegesi ezingxenyeni ze-elekthronikhi, ukupakishwa kwe-semiconductor, kanye nama-PCB. Lihlose ukuthola ngokushesha amaphutha afihliwe, lifinyeze kakhulu imijikelezo yokuthuthukiswa komkhiqizo kanye nokuqinisekiswa kwekhwalithi.

CELA ISIKHOKELO SAMAHHALA

Imininingwane Yomkhiqizo

Amathegi Omkhiqizo

Isakhiwo somkhiqizo
1	Igumbi lokuhlola lakhiwe ngebhokisi lokufaka umfutho (isakhiwo sokuthwala ingcindezi) ngaphambili, iyunithi yesiqandisi kanye ne-vacuum ngemuva kanye nesilawuli sikagesi (uhlelo) esangweni legumbi lokuhlola.
2	Iphaneli yokulawula kagesi ibekwe emnyango wangaphambili webhokisi lokuhlola ukuze kube lula ukuyisebenzisa.
3	Iyunithi yesiqandisi kanye neyunithi ye-vacuum kufanele zibekwe ebhokisini elizimele ukuze kuncishiswe umthelela wokudlidliza nomsindo ngesikhathi sokusebenza kweyunithi yesiqandisi ebhokisini lokuhlola futhi kube lula ukufakwa nokugcinwa kwemishini.
4	Ukuze kuncishiswe umsindo okhiqizwa ngesikhathi sokusebenza kweyunithi yokufudumeza, kufakwa izinto ezikhethekile zokumunca umsindo wesiponji ukuze kufakwe umsindo kanye nokuvikela umsindo odongeni lwangaphakathi lwebhokisi. Kuthathwa izinyathelo zokulwa nokudlidliza kanye nokunciphisa umsindo ezingxenyeni eziyinhloko ezihambayo.

Amazinga
1	Izimo Zobuchwepheshe ze-GB/T10586-1989 zeLabhorethri Yokushisa Okumanzi.
2	GB2423.3-93 (IEC68-2-3) Ukuhlolwa komswakama nokushisa okungaguquki.
3	Indlela ye-MIL-STD810D 502.2.
4	Ukuhlolwa kokushisa nomswakama kwe-GJB150.9-8.
5	GB2423.34-86, MIL-STD883C Indlela 1004.2 Ukuhlolwa Kokujikeleza Okuhlanganisiwe Kokushisa Nomswakama kanye Nokucindezela Okuphezulu.